CoWoS(Chip-on-Wafer-on-Substrate)：CoWoS是一種整合生產技術，先將晶片通過Chip on Wafer(CoW)的封裝制程連接矽晶圓，再把CoW晶片與基板連接，整合成Chip-on-Wafer-on-Substrate。

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5. Application of CoWoS :

• AI
• Server
• Networking

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2. Characteristic of CoWoS :

• Ultra-high performance,
• SoC partition
• Very high memory bandwidth
• Wide envelope
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5. Strengths of CoWoS

• Fine RDL pitch & High TSV density Si interposer
• Fine pitch Micro-bump Assembly
• Fine gap Flip Chip underfill
• CoW warpage control
• Large die reliability