Ajinomoto Buildup Film

The Ajinomoto Buildup Film (ABF) is the primary dielectric for SAP. It is a series of very thin film dielectrics made with epoxy/phenol hardener, cyanate ester/epoxy, and cyanate ester with thermosetting olefin (Table 2). The epoxy type is also available halogen-free. The thin film (15 – 100 um thick) is supported by a 38 um PET film and protected by a 16 um OPP cover film. The material is vacuum laminated in special conveyorized machines (Figure 3) using a five-step process: 

• -Surface preparation of core dielectric and copper
• -Dry core (130 C for 30 min)
• -ABF auto-cutting, remove cover film, and placement
• -ABF vacuum lamination and metal hot-press
• -Remove PET film and post-cure (170-190 C for 30 min.)
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• ABF films, like the liquid dielectrics and dry films, must be semi-additively metallized (SAP). The critical steps are desmear, solvent swell, film etch before metallization, etching, and annealing (post-curing). The conditions and steps will determine the resulting copper peel strengths and are covered in ‘Chapter 8—Desmear and Metallization’ of the HDI Handbook. 
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• 資料來源: https://resources.altium.com/