日月光還描述了一些晶片Fan-Out製程上會遇到問題以及如何解決它們。晶圓翹曲會是個問題，會影響產量。在某些情況下，玻璃載體的厚度和熱膨脹係數(CTE)是導致翹曲的原因所在。

ASE also described some of the manufacturing issues with chip-last fan-out and how to address them. As stated, wafer warpage is problematic and impacts yield. In some cases, the thickness and coefficient of thermal expansion (CTE) of the glass carrier are among the issues that cause warpage.

為了深入瞭解晶片翹曲問題，日月光採用了三維分析的計量技術。採用了數位圖像相關(DIC)技術，這是一種使用多個攝像機的非接觸測量技術。DIC評估表面上的位移和應變，並繪製座標。使用模擬和DIC, 日月光能夠找到最佳範圍的玻璃載體厚度和CTE，以改善晶圓翹曲。

To gain an insight into wafer warpage, ASE used a metrology technology with three-dimensional finite element analysis. ASE used digital image correlation (DIC), which a non-contact measuring technique that uses multiple cameras. DIC evaluates displacement and strain on surfaces and maps the coordinates. Using simulations and DIC, ASE is able to find the optimum range of the glass carrier thickness and CTE to improve warpage.

資料來源: https://semiengineering.com/