Ajinomoto build-up films (ABF) layers are widely used as package substrates. The increasing demand for electronic devices with advanced functions, package substrates are required to be miniaturized with high-density circuit wirings.

   
• New ABF combination, low CTE, high Young’s modulus, demonstrated as a high-tech resin coated copper (RCC) filmfor fine line formation. ABF materials are improved with the progress of IC.

   
• Very thin copper transfer film and ABF-prepregs which are glass-cloth materials impregnated with ABF resin compositions, are proposed for use as core materials, especially for CSP substrates.

    
• These new applications can achieve the high adhesion between the copper and insulating layers.

   
• The material is a series of very thin film dielectrics made with epoxy/phenol hardener, cyanate ester/epoxy, and cyanate ester with thermosetting olefin.

   
• The epoxy type is also available halogen-free, the thin film (15 – 100um thick) is supported by a 40um PET film and protected by a 16um OPP cover film.

     
• The material is vacuum laminated in special machines using.