Wafer Protection Film

●Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer.

●Excellent laser marking quality.

●Excellent adhesion performance with metal .

●Excellent heat dissipation.

●Application for Infrared (IR) Transmission inspection of wafer backside.

●Control wafer warpage for RDL process.

●Can Customize film feature i.e. magnetic, transparent...etc.

●Eco-friendly, do not contain toluene

Width:

• 220mm for 8” Wafer
• 330mm for 12” Wafer
• 500~680mm for Panel Size
• Customized Size
•          

Thickness:

 20 ~ 200 um

Applications:

SiP, WLP, WLCSP, Flipchip, Stacked die, Fan-out, Fan-in, 3D IC