Advanced Packaging Material: Wafer Warpage Control Film
2021-02-02Advanced Packaging Material: Wafer Warpage Control Film
●Can control any wafer warpage for RDL process.
●Excellent laser marking quality.
●Excellent adhesion performance with metal .
●Excellent heat
●Application for Infrared (IR) Transmission inspection of wafer backside.
●Can Customize film feature i.e. magnetic, transparent...etc.
●Eco-friendly, do not contain toluene
Width:
- 220mm for 8” Wafer
- 330mm for 12” Wafer
- 500~680mm for Panel Size
- Customized Size
Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging