Advanced Packaging Material: Wafer Warpage Control Film

2021-02-02

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Wafer Warpage Control Film

   

●Can control any wafer warpage for RDL process. 

●Excellent laser marking quality.

●Excellent adhesion performance with metal .

●Excellent heat dissipation.

●Application for Infrared (IR) Transmission inspection of wafer backside.

●Can Customize film feature i.e. magnetic, transparent...etc.

●Eco-friendly, do not contain toluene

   

Width:

     

  • 220mm for 8” Wafer
  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size
  •             

Thickness:

 20 ~ 200 um

   

Applications: 

Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging