WaferChem Build-Up Film

●Independent research and manufacure in Taiwan

● copper can chemical plating on the build-Up film which can replace traditional copper foil substrate.

●can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate.

●Excellent adhensive performance, chemical resistance and grinding material.

●Low CTE to reduce package warpage

●Low Dk & Df

●Preservation condition (0-5 degreeC  6 Months )

●Eco-friendly, do not contain toluene

Width:

• 220mm for 8” Wafer
• 330mm for 12” Wafer
• 500~680mm for Panel Size
• Customized Size
•             

Thickness:

 20 ~ 200 um

Applications:

IC interlayer dielectric material, coreless substrate, 5G product