Transparent Molding Film  

●Independent research and manufacure in Taiwan

● Transparent feature let 3D IC packaging stack and align easily.

●Excellent adhensive performance, chemical resistance and grinding material.

●Excellent gap filling ability, protect device from moisture damage.

●Low CTE and no die-shift.

●Low Dk & Df.

●Eco-friendly, do not contain toluene.

Product Structure:

Width:

• 220mm for 8” Wafer
• 330mm for 12” Wafer
• 500~680mm for Panel Size
• Customized Size
•             

Thickness:

 20 ~ 200 um

Applications:

Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging

Mini/Micro LED packaging (Effective protection of LED chip and prevent falling off)