ABF build-up film was successfully developed by WaferChem
2021-04-14ABF build-up film was successfully developed by WaferChem
ABF sbustrate is in short supply, and the material fits the current need for high-frequency communications and high-speed computing to take on the task of connecting expensive chips. "For high-order ABF pads, the yield is almost zero." Industry sources said, so TSMC, PTI are closely watching the production schedule of the board plant.
An executive of a sealing and testing plant said: "The supply situation of the carrier plate now directly affects the advanced packaging capacity." At present, 99% of ABF build-up film on the market are supplied by Japan Ajinomoto. Due to limited production capacity, the supply is in short supply. Many domestic and foreign customers have reported that the lead time is as long as 30 weeks, so they turn to WaferChem Technology for help.
In order to overcome the problem that ABF materials are monopolized by Japanese manufacturers and the production capacity is insufficient. In recent years, WaferChem Technology has devoted all its efforts to the independent research and development of semiconductor wafer lever packaging film materials and ABF build-up materials. WaferChem is also the only leader in the field of ABF film materials in Taiwan, hoping to promote the localization of Taiwan semiconductor material supply chain.
Taiwan WaferChem Technology Co., Ltd. is the first manufacturer of independent research and development and production of laminated materials in Taiwan. At present, it has corresponding products for GZ,GY and GX series. At present, several products have been verified by many semiconductor companies.
