Today's electronic products are almost all SoC (System on Chip), all functions and performance are almost defined by the IC specification, so the back-end package IC board design technology and materials, will play a very important role in ensuring that the ultimate support for the high-speed performance of IC chips. At present, ABF (Ajinomoto Build-Up Film) is the most popular laminating material for high-order IC board in the market, and the main suppliers of ABF materials are all Japanese manufacturers, such as Ajinomoto (Ajinomoto) and Sekisui Chemical (Water Chemistry). Taiwan Crystal Technology Co., Ltd. is the first manufacturer of TBF (Taiwan Build-Up Film) laminating materials independently developed and produced in China. At present, the products have passed the verification of many manufacturers at home and abroad and have been shipped in small quantities.

    ABF is a key material for high-order IC load-adding materials. The annual usage of ABF materials - Unimicron, Nan-Ya PCB and Kinsus is quite high, accounting for more than 80% of the world's total. According to IEK, the annual market for ABF materials in Taiwan is estimated at more than NT $16 billion.

    At present, 99% of ABF laminating materials on the market are supplied by Japan Ajinomoto. In order to overcome the monopoly of ABF materials by Japanese manufacturers,WaferChem Technology has been fully engaged in the independent research and development of semiconductor high-order packaging film materials and ABF loading plate materials in recent years, and it is also the only leader in the field of laminating film materials in Taiwan. Hope to promote Taiwan semiconductor materials supply chain in the localization.

    The Taiwan build-up Film made in Taiwan is used to improve the supply chain of Taiwan ABF loadboard.

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