品化科技為台灣雷射切割保護液專業供應商

客戶: 竹科廠商, 光電LED廠

可少量 or 小包材出貨，歡迎學校和研究單位來電詢問!            

雷射切割保護液GSP系列 (適用於綠光)

GSP系列為透明可剝離保護劑，沾附性佳，乾燥後塗膜可剝離性優異，適用於塑膠，金屬，玻璃與陶瓷表面暫時保護,使用後可完全以熱水剝除無殘膠(SCUM)，不侵蝕底材維持優異剝離性。

適用範圍

適用於雷射加工製程中塑膠，金屬，玻璃與陶瓷表面 之暫時保護，以避免雷射過程中噴濺之粒子沾黏於工件表面；經熱水洗與烘烤製程後可完全剝除無殘膠。

使用方法

Spin Coating, Spray, Brush 

去除方法:

清水沖洗or溫水沖洗即可

Recommended use and restriction on use:

Water-soluble protective coating material. Protective coating material for laser dicing.

LD-002 series (適用於紅光)

Water-soluble, non-corrosive protective coating materials which is designed specifically for the ultraviolet- and infra-red laser grooving process in Outsource-Semiconductor Assembly Technology (OSAT).

• Optimized formulation to prevent thermal adhesion of debris, materials peeling / de-lamination, or PI-burning on chips
     
• Improved lubricity during grooving process while leaving no ionic or organic contamination on die surface even after prolong hours of coating
•          
• PROPERTIES
  ◎ Water- soluble composition
  ◎To provide a coating protection for wafers
  ◎To prevent adhesion of debris during processing
  ◎ Reduces burning during laser dicing
  ◎ Higher Thermal Resistance–Use of polyvinylpyrrolidone (PVP) which gives a higher decomposition temperature of >300degC which is an improvement from the use of polyvinyl alcohol (PVA) which only has a decomposition temperature of around200degC.
  ◎ More Uniform and Even Heat Distribution –Constituting additives adequately absorbs the laser energy which thus promotes more uniform and even heat distribution
  ◎ Easy to Remove –Laser grooving liquidis easy to clean off after laser processing just by cleaning with deionized water

Water Solubility Comparison Test測試

-我司LD系列產品性能優於MXX003

-Fine lines: Line width and uniformity ofLD product showed similar result with Mxx003