Introduction: 

Water-soluble, non-corrosive protective coating materials which is designed specifically for the ultraviolet- and infra-red laser grooving process in Outsource-Semiconductor Assembly Technology (OSAT).

• Optimized formulation to prevent thermal adhesion of debris, materials peeling / de-lamination, or PI-burning on chips
   
• Improved lubricity during grooving process while leaving no ionic or organic contamination on die surface even after prolong hours of coating
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• Advantages:
  ◎ Water- soluble composition
  ◎To provide a coating protection for wafers
  ◎To prevent adhesion of debris during processing
  ◎ Reduces burning during laser dicing
  ◎ Higher Thermal Resistance–Use of polyvinylpyrrolidone (PVP) which gives a higher decomposition temperature of >300degC which is an improvement from the use of polyvinyl alcohol (PVA) which only has a decomposition temperature of around200degC.
  ◎ More Uniform and Even Heat Distribution –Constituting additives adequately absorbs the laser energy which thus promotes more uniform and even heat distribution
  ◎ Easy to Remove –Laser grooving liquidis easy to clean off after laser processing just by cleaning with deionized water