Advanced Molding Technology for IC Packaging - WaferChem
2021-11-01Advanced Molding Technology for IC Packaging - WaferChem
WaferChem Technology Co., Ltd., founded in 2015, always persists in the business idea and policy of innovation, good service, good quality, honesty and excellence, which focus on the advanced packaging material for semiconductor and OSAT industries.
What we can do for advanced packaging