Wafer Warpage Control Film

● Independent research and manufacure in Taiwan (WaferChem Technology)

● Can control any wafer warpage for RDL process. 

● Excellent laser marking quality.

● Excellent adhesion performance with metal .

● Excellent heat dissipation.

● Application for Infrared (IR) Transmission inspection of wafer backside.

● Can Customize film feature i.e. magnetic, transparent...etc.

● Eco-friendly, do not contain toluene

Product Structure:  

Width:

• 220mm for 8” Wafer
• 330mm for 12” Wafer
• 500~680mm for Panel Size
• Customized Size
•          

Thickness:

 20 ~ 200 um

Applications: 

Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging