Taiwan Build-Up film for ABF substrate
2021-12-02Taiwan Build-Up film for ABF substrate
Taiwan Build-Up Film
● Independent research and manufacure in Taiwan
● Copper can chemical plating on the build-Up film which can replace traditional copper foil substrate.
● Can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate.
● Excellent adhensive performance, chemical resistance and grinding material.
● Low CTE to reduce package warpage
● Low Dk & Df
● Preservation condition better than Japan Brand (0-5 degreeC 6 Months )
● Eco-friendly, do not contain toluene
Product Structure:
Taiwan Build-Up Film Process Flow
Width:
- 220mm for 8” Wafer
- 330mm for 12” Wafer
- 500~680mm for Panel Size
- Customized Size
Thickness:
20 ~ 200 um
Applications:
IC interlayer dielectric material, coreless substrate, 5G product, ABF substrate
