Warpage control solution for Advanced Packaging
2022-01-13Warpage control solution for Advanced Packaging
Wafer Warpage Control Film
● Independent research and manufacure in Taiwan
● Can control any wafer warpage for RDL process.
● Excellent laser marking quality.
● Excellent adhesion performance with metal and glass .
● Excellent heat
● Application for Infrared (IR) Transmission inspection of wafer backside.
● Can Customize film feature i.e. magnetic, transparent...etc.
● Eco-friendly, do not contain toluene
Product Structure:
Width:
220mm for 8” Wafer
- 330mm for 12” Wafer
- 500~680mm for Panel Size
- Customized Size
Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging, Heterogeneous Integration
More info: https://www.waferchem.com.tw/waferwarpagecontrolfilm-en.html