Warpage control solution for Advanced Packaging

2022-01-13

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Wafer Warpage Control Film

  

● Independent research and manufacure in Taiwan 

● Can control any wafer warpage for RDL process. 

● Excellent laser marking quality.

● Excellent adhesion performance with metal and glass .

● Excellent heat dissipation.

● Application for Infrared (IR) Transmission inspection of wafer backside.

● Can Customize film feature i.e. magnetic, transparent...etc.

● Eco-friendly, do not contain toluene

   

Product Structure:  

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Width:

220mm for 8” Wafer

  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size
  •          

Thickness:

 20 ~ 200 um

    

Applications: 

Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging, Heterogeneous Integration

     

More info: https://www.waferchem.com.tw/waferwarpagecontrolfilm-en.html