Wafer-level packaging through a compression molding process is becoming a mainstream semiconductor packaging technology, following development of fan-out wafer-level packaging (FOWLP) and technology such as 2.5D packaging and other advanced packaging process. One of the primary problems in compression molding is wafer warpage. 

    The encapsulant, such as an epoxy molding compound, and the Si wafer, carrier, or substrate have individual coefficients of thermal expansion (CTE), and different CTEs cause warpage when two different materials are laminated. To facilitate machine handling of the wafer, the warpage should be near zero (normally under 1mm) in any process. Zero warpage is also preferable for package reliability, because there is no stress at the interfaces between different materials. 

    WaferChem wafer warpage control film has been designed to solve the problem of wafer warpage. The properties such as the glass transition temperature (Tg), modulus, and shrinkage rate are designed to enable warpage control in most of the wafer-level encapsulation processes.

Wafer Warpage Control Film

● Independent research and manufacure in Taiwan 

● Can control any wafer warpage for RDL process. 

● Excellent laser marking quality.

● Excellent adhesion performance with metal and glass .

● Excellent heat dissipation.

● Application for Infrared (IR) Transmission inspection of wafer backside.

● Can Customize film feature i.e. magnetic, transparent...etc.

● Eco-friendly, do not contain toluene

https://www.waferchem.com.tw/waferwarpagecontrolfilm-en.html