Wafer Protection Film

● Independent research and manufacure in Taiwan 

● Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer.

● Excellent laser marking quality.

● Excellent adhesion performance with metal .

● Excellent heat dissipation.

● Application for Infrared (IR) Transmission inspection of wafer backside.

● Control wafer warpage for RDL process.

● Can Customize film feature i.e. magnetic, transparent...etc.

● Eco-friendly, do not contain toluene

Product Structure: