In response to the growing demand for advanced computing capabilities, heterogeneous integration packaging technology for chiplets has emerged as a significant trend, particularly in the domain of ABF substrates. This cutting-edge approach enables the integration of chips from different fabs, diverse process nodes, and varying attributes into a single package. The trend is poised to revolutionize ABF substrate properties, including layer count, surface area, circuit density, and manufacturing complexity.

The proliferation of high-end semiconductor processes is propelling the need for ABF substrates. Chiplets, or small chip components, are pivotal to this evolution, allowing for the seamless integration of various chips into a cohesive unit. As this technology extends its reach across sectors, ABF substrate demand, which has been in surplus by 5% this year, is projected to experience a dramatic shift. By 2024 and 2025, the landscape is forecasted to reverse, leading to a supply shortage of 5% and 8%, respectively.

Focusing on AI servers, a detailed analysis of the prominent NVIDIA DGX A100 hardware reveals the centrality of GPU modules, constituting a staggering 80% of the overall PCB cost. These modules comprise 8 GPU chips and 6 NV Switch chips, all enclosed within ABF substrate packaging. While 8 GPU accelerator cards are manufactured with high-density interconnect (HDI) boards, a single GPU mainboard employs high-layer-count (HLC) boards for production efficiency.

In light of the significance of additive films as a critical material in ABF substrate production, the risk associated with relying on a single source has gained prominence. To mitigate this risk, several substrate manufacturers are now exploring WaferChem's additive materials, aiming to diversify their supply chains and minimize the threat of production discontinuity due to geopolitical factors.

As the semiconductor industry continues to evolve, the adoption of heterogeneous integration and advanced packaging technologies is expected to reshape the landscape, underscoring the critical role of ABF substrates in enabling these innovations.