TSMC renowned for its technological prowess, has once again captured the attention of investors with its cutting-edge packaging technology, "CoWoS." This focus on CoWoS capacity was underscored at a recent analyst conference, where industry experts honed in on this strategic aspect. Given the close correlation between CoWoS technology and 3/4 nanometer processes, as well as the burgeoning demand for AI servers, the market's interest in this innovation remains on a steady ascent. Forecasts indicate that TSMC may need to more than double its production capacity to satiate the pressing market demands.

TSMC has unequivocally announced its plans to significantly amplify CoWoS technology production this year, addressing the demand head-on.

In the realm of advanced packaging, Taiwan's high-end electronic chemical factories have formed robust collaborations with semiconductor entities. Central to CoWoS technology is the pivotal component of ABF substrates, a role that Taiwan's WaferChem has undertaken by producing TBF (Taiwan Build-Up Film) materials—the sole indigenous manufacturer of ABF substrate additives in the country. Aligned with TSMC's initiatives, along with those of other global clientele, to expedite supply chain localization and curtail dependence on Japanese imports, numerous substrate customers are currently immersed in verification and testing phases. The performance benchmarks of these domestic materials rival those of their Japanese counterparts, with an anticipated prospect of catalyzing a pivotal upswing in performance come next year.

In summation, TSMC continues to exhibit an open-minded ethos, a fervor-driven attitude, unwavering self-assurance, and a continuous commitment to innovation. These attributes have solidified its position as a trailblazer within the semiconductor sphere. As CoWoS technology and advanced packaging sustain their developmental momentum, Taiwan's semiconductor industry is poised to remain an essential protagonist on the global stage.