The Metal Lift-Off Process generally refers to the process of exposing a pattern into photoresist (or different material), depositing a thin film such as a metal or dielectric over the entire substrate area, and then removing or washing away the photoresist and excess metal leaving behind metal only in the designated patterned substrate area.

This process has commonly been done through a wet chemical process, but WaferChem has developed a faster, more cost-effective, more environmentally-friendly alternative  Metal Lift-off film.