HPC/AI先進封裝平台 持續使用Build-Up載板

2024-03-11

Build-up substrate 未來需求持續存在! 關鍵材料Build-up film成為技術核心! 目前材料主要被日廠掌握, Waferchem為世界第三家有能力量產build-up film的廠家, 未來具備爆發的潛力

    

The ongoing demand for build-up substrates is anticipated in the future, with the key material, build-up film, becoming the technological core. Currently, these materials are predominantly controlled by Japanese manufacturers. WaferChem is the third company globally with the capability to mass-produce build-up film, indicating significant potential for future growth.
      
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