Molding Sheet/ Film 系列產品為晶圓封裝材料使用
●適用於WLCSP/MUF製程
●製程簡易
●有效控制晶圓翹曲
●具有良好的研磨特性
●具有優異缺口填補性,有效保護元件不受濕氣傷害
●具有良好的耐化性,可延續RDL製程
●低楊式系數和低膨脹係數
●可以改善封裝過程中翹曲(Warpage)的問題
Molding Sheet and Film are the molding compound for wafer level package
●Application for WLCSP process
●Easy process
●Control the warpage of
●Excellent grind ability
●Excellent gap filling, protect device from moisture uptake
●Excellent chemical resistance for
●Low modulus and low CTE
膜厚: 可客製化 10~200 um