如何使用雷射切割保護劑?

2020-04-29

品化科技販售的雷射切割保護劑為透明琥珀色可剝離保護劑,沾附性佳,乾燥後塗膜可剝離性優異,適用於塑膠,金屬,玻璃與陶瓷表面暫時保護,使用後可完全以熱水剝除無殘膠(SCUM),不侵蝕底材維持優異剝離性。

     
適用範圍:
適用於雷射加工製程中塑膠,金屬,玻璃與陶瓷表面 之暫時保護,以避免雷射過程中
噴濺之粒子沾黏於工件表面;經熱水洗與烘烤製程後可完全剝除無殘膠。

      

使用方法:

1. 塗膜於室溫下, 將保護劑塗抹於工件上, 觀察表面塗膜均勻無破洞
2. 乾燥條件 Drying Condition 以70~80℃烘箱, 乾燥5~10 分鐘

3. 剝除條件溫度 60~80℃以浸泡熱水剝除(加超音波清洗更佳) 

   

LD series

AppliChem sells LD series laser cutting protection: Water-soluble, non-corrosive protective coating materials which is designed specifically for the ultraviolet- and infra-red laser grooving process in Outsource-Semiconductor Assembly Technology (OSAT).

  • Optimized formulation to prevent thermal adhesion of debris, materials peeling / de-lamination, or PI-burning on chips
       
  • Improved lubricity during grooving process while leaving no ionic or organic contamination on die surface even after prolong hours of coating