台灣雷射切割保護液專業供應商
客戶: 竹科廠商, 光電LED廠
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雷射切割保護液GSP系列 (適用於紅光&綠光)
GSP系列為透明可剝離保護劑，沾附性佳，乾燥後塗膜可剝離性優異，適用於塑膠，金屬，玻璃與陶瓷表面暫時保護,使用後可完全以熱水剝除無殘膠(SCUM)，不侵蝕底材維持優異剝離性。
適用範圍
適用於雷射加工製程中塑膠，金屬，玻璃與陶瓷表面 之暫時保護，以避免雷射過程中噴濺之粒子沾黏於工件表面；經熱水洗與烘烤製程後可完全剝除無殘膠。
使用方法
Spin Coating, Spray, Brush
去除方法:
清水沖洗or溫水沖洗即可
Recommended use and restriction on use:
Water-soluble protective coating material. Protective coating material for laser dicing.
LD-002 series (適用於紅光&紫光)
Water-soluble, non-corrosive protective coating materials which is designed specifically for the ultraviolet- and infra-red laser grooving process in Outsource-Semiconductor Assembly Technology (OSAT).
- Optimized formulation to prevent thermal adhesion of debris, materials peeling / de-lamination, or PI-burning on chips
- Improved lubricity during grooving process while leaving no ionic or organic contamination on die surface even after prolong hours of coating
- PROPERTIES
◎ Water- soluble composition
◎To provide a coating protection for wafers
◎To prevent adhesion of debris during processing
◎ Reduces burning during laser dicing
◎ Higher Thermal Resistance–Use of polyvinylpyrrolidone (PVP) which gives a higher decomposition temperature of >300degC which is an improvement from the use of polyvinyl alcohol (PVA) which only has a decomposition temperature of around200degC.
◎ More Uniform and Even Heat Distribution –Constituting additives adequately absorbs the laser energy which thus promotes more uniform and even heat distribution
◎ Easy to Remove –Laser grooving liquidis easy to clean off after laser processing just by cleaning with deionized water
Water Solubility Comparison Test測試
-我司LD系列產品性能優於國外大廠
-Fine lines: Line width and uniformity of LD product showed similar result with competitor
新產品: 綠光雷射切割保護液
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