雷射切割保護液為多功能複合材料，可避免切割時碎屑噴濺破壞Wafer 表面。具有優異的散熱、阻熱、冷卻功能，減少熱效應。有效的防止切割後的碎屑噴濺到晶圓表面及阻止雷射的熱能擴散造成切割道過大。切割後的清洗，容易快速及乾淨的從晶圓表面移除。

品化科技販售多款雷射切割保護液，歡迎來電詢問。

The laser protective coating material is a versatile composite that prevents the dicing splash from damaging the Wafer surface. Its excellent heat dissipation, heat resistance and cooling functions can reduce thermal effects, effectively prevent chipped debris from splashing onto the surface of the wafer, and prevent thermal energy of the laser from spreading and enlarging the dicing line. It is easy to clean and remove from the wafer surface after dicing.