晶圓翹曲調控膜

應用:      

●可以調控各種封裝後翹曲程度, 以利後續RDL製程

●具優異耐化性, 可延續RDL製程 

●具良好的研磨特性

●介面接著力強

●增加晶圓強度

●可客製化開發

●可替代日本品牌

●用於Fan-Out等先進製程

●應用於異質整合封裝

●可取代L牌LC Tape膠帶

●在地供應價格優

厚度:

20~200 um

規格:

客戶:

多家半導體廠商

驗證: 

實績: 

詳情請聯絡我們

歡迎致電或來信索取公司產品型錄

#半導體  #封裝  #Fanout

#扇出  #客制化  #翹曲調控膜  #晶化科技

#晶圓保護 #先進封裝 #RDL #台灣研發 #台灣生產 #關鍵材料自主化 #材料供應在地化

#半導體國產化

 Wafer-level packaging through a compression molding process is becoming a mainstream semiconductor packaging technology, following development of fan-out wafer-level packaging (FOWLP) and technology such as 2.5D packaging and other advanced packaging process. One of the primary problems in compression molding is wafer warpage. 

       The encapsulant, such as an epoxy molding compound, and the Si wafer, carrier, or substrate have individual coefficients of thermal expansion (CTE), and different CTEs cause warpage when two different materials are laminated. To facilitate machine handling of the wafer, the warpage should be near zero (normally under 1mm) in any process. Zero warpage is also preferable for package reliability, because there is no stress at the interfaces between different materials. 

   WaferChem wafer warpage control film has been designed to solve the problem of wafer warpage. The properties such as the glass transition temperature (Tg), modulus, and shrinkage rate are designed to enable warpage control in most of the wafer-level encapsulation processes.

Wafer Warpage Control Film

● Independent research and manufacure in Taiwan 

● Can control any wafer warpage for RDL process. 

● Excellent laser marking quality.

● Excellent adhesion performance with metal and glass .

● Excellent heat dissipation.

● Application for Infrared (IR) Transmission inspection of wafer backside.

● Can Customize film feature i.e. magnetic, transparent...etc.

● Eco-friendly, do not contain toluene

#半導體關鍵材料

#晶圓翹曲

#晶圓翹曲解決方案

#台灣研發

#台灣發明